▍ The future of humanity is directly tied to the future of compute.
We build the toolsfor future compute.
A new application of plasma physics operating in a window that magnetron PVD, CVD, ALD, and PECVD cannot reach.
Why it matters: the demand for frontier compute is doubling every six months. Power per AI accelerator has passed 1,000W and keeps rising. Over $1.5 trillion is flowing into new fabs through 2030. The constraint is no longer software, design, or even lithography. It is physical.
Every chip is built in two steps: patterning and deposition. ASML turned patterning into a step change, and EUV now draws features at atomic scale. Deposition did not follow. High-volume deposition still runs on fifty-year-old physics. Push today's tools toward what the next node needs and the film stack breaks. They trade quality for speed. They contaminate what they deposit. They offer no precise control over how atoms land.
Today's tools cannot produce the materials next-gen chips need. Every further gain in compute now depends on solving this bottleneck. HallTech is building the platform to unlock next-gen materials, with the purity, quality, and control no other tool delivers together.
Help break the physical barrier of compute.
We are growing our team in the Netherlands and the United States of America.